TSMC is planning to adopt double patterning extensively at 20nm, despite the high cost of doing so. Why? Because EUV hasn't come through.
[img]http://feeds.feedburner.com/~ff/ziffdavis/extremetech?d=yIl2AUoC8zA[/img]</img> [img]http://feeds.feedburner.com/~ff/ziffdavis/extremetech?d=Gu391qSwH_A[/img]</img> [img]http://feeds.feedburner.com/~ff/ziffdavis/extremetech?i=UzWc4prgsgY:FqXyM535f7Y:V_sGLiPBpWU[/img]</img> [img]http://feeds.feedburner.com/~ff/ziffdavis/extremetech?i=UzWc4prgsgY:FqXyM535f7Y:F7zBnMyn0Lo[/img]</img> [img]http://feeds.feedburner.com/~ff/ziffdavis/extremetech?d=dnMXMwOfBR0[/img]</img> [img]http://feeds.feedburner.com/~ff/ziffdavis/extremetech?d=TzevzKxY174[/img]</img>
[img]http://feeds.feedburner.com/~r/ziffdavis/extremetech/~4/UzWc4prgsgY[/img]

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